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Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies
Krzysztof Iniewski (ed)
Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies
ean9781439869758
temáticaINGENIERÍA, ÓPTICA / LÁSERS
año Publicación2012
idiomaINGLÉS
editorialTAYLOR AND FRANCIS
formatoCARTONÉ


114,95 €


   PEDIR
 
NOVEDAD
 
Últimas novedades
ingeniería
óptica / lásers
Light on physics and math, with a heavy focus on practical applications, Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies discusses the developments necessary to realize the growth of truly integrated sensors for use in physical, biological, optical, and chemical sensing, as well as future micro- and nanotechnologies.

Used to pick up sound, movement, and optical or magnetic signals, portable and lightweight sensors are perpetually in demand in consumer electronics, biomedical engineering, military applications, and a wide range of other sectors. However, despite extensive existing developments in computing and communications for integrated microsystems, we are only just now seeing real transformational changes in sensors, which are critical to conducting so many advanced, integrated tasks.

This book is designed in two sections—Optical and Acoustic Sensors and Magnetic and Mechanical Sensors—that address the latest developments in sensors.

The first part covers:


•Optical and acoustic sensors, particularly those based on polymer optical fibers

•Potential of integrated optical biosensors and silicon photonics

•Luminescent thermometry and solar cell analyses

•Description of research from United States Army Research Laboratory on sensing applications using photoacoustic spectroscopy

•Advances in the design of underwater acoustic modems
The second discusses:


•Magnetic and mechanical sensors, starting with coverage of magnetic field scanning

•Some contributors’ personal accomplishments in combining MEMS and CMOS technologies for artificial microsystems used to sense airflow, temperature, and humidity

•MEMS-based micro hot-plate devices

•Vibration energy harvesting with piezoelectric MEMS

•Self-powered wireless sensing
As sensors inevitably become omnipresent elements in most aspects of everyday life, this book assesses their massive potential in the development of interfacing applications for various areas of product design and sciences—including electronics, photonics, mechanics, chemistry, and biology, to name just a few.
Contents
PART 1: Optical and Acoustic Sensors
Optical Fiber Sensors, R. Nogueira, L. Bilro, N. Alberto, H. Lima, and J. Lemos Pinto
Sensors Based on Polymer Optical Fibers: Microstructured and Solid Fibers, C.-A. Bunge and H. Poisel
Label-Free Biosensors for Biomedical Applications: The Potential of Integrated Optical Biosensors and Silicon Photonics, J.W. Chamberlain and D.M. Ratner
Luminescent Thermometry for Sensing Rapid Thermal Profiles in Fires and Explosions, J.J. Talghader and M.L. Mah
Solar Cell Analyses with Ultraviolet–Visible–Near-Infrared Spectroscopy and I–V Measurements, A. Stadler
Sensing Applications Using Photoacoustic Spectroscopy, E.L. Holthoff and P.M. Pellegrino
Design of a Low-Cost Underwater Acoustic Modem, B. Benson and R. Kastner

PART 2: Magnetic and Mechanical Sensors
Accurate Scanning of Magnetic Fields, H. Husstedt, U. Ausserlechner, and M. Kaltenbacher
Artificial Microsystems for Sensing Airflow, Temperature, and Humidity by Combining MEMS and CMOS Technologies, N. André, L.A. Francis, B. Rue, D. Flandre, and J.-P. Raskin
Microelectromechanical System-Based Micro Hot-Plate Devices, J. Hildenbrand, A. Greiner, and J.G. Korvink
Vibration Energy Harvesting with Piezoelectric Microelectromechanical Systems, M. Marzencki and S. Basrour
Self-Powered Wireless Sensing in Ground Transport Applications, A. Kasyap and A. Edrington


Author BioKrzysztof (Kris) Iniewski manages R&D at Redlen Technologies Inc., a start-up company in Vancouver, British Columbia, Canada. Redlen’s revolutionary production process for advanced semiconductor materials is enabling a new generation of more accurate, all-digital, radiation-based imaging solutions. Dr. Iniewski is also president of CMOS Emerging Technologies, which organizes high-tech events covering communications, microsystems, optoelectronics, and sensors. Dr. Iniewski has held numerous faculty and management positions at the University of Toronto, the University of Alberta, SFU, and PMC-Sierra, Inc. He holds 18 international patents, has published more than 100 research papers in international journals and conferences, and has written and edited several books. He is frequently invited as a speaker and has consulted for several organizations around the world.

Related SubjectsOptics & optoelectronicsElectromagnetics & MicrowavesInstrumentation, Measurement & TestingNanoscience & Nanotechnology
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PART 1: Optical and Acoustic Sensors

Optical Fiber Sensors, R. Nogueira, L. Bilro, N. Alberto, H. Lima, and J. Lemos Pinto

Sensors Based on Polymer Optical Fibers: Microstructured and Solid Fibers, C.-A. Bunge and H. Poisel

Label-Free Biosensors for Biomedical Applications: The Potential of Integrated Optical Biosensors and Silicon Photonics, J.W. Chamberlain and D.M. Ratner

Luminescent Thermometry for Sensing Rapid Thermal Profiles in Fires and Explosions, J.J. Talghader and M.L. Mah

Solar Cell Analyses with Ultraviolet–Visible–Near-Infrared Spectroscopy and I–V Measurements, A. Stadler

Sensing Applications Using Photoacoustic Spectroscopy, E.L. Holthoff and P.M. Pellegrino

Design of a Low-Cost Underwater Acoustic Modem, B. Benson and R. Kastner



PART 2: Magnetic and Mechanical Sensors

Accurate Scanning of Magnetic Fields, H. Husstedt, U. Ausserlechner, and M. Kaltenbacher

Artificial Microsystems for Sensing Airflow, Temperature, and Humidity by Combining MEMS and CMOS Technologies, N. André, L.A. Francis, B. Rue, D. Flandre, and J.-P. Raskin

Microelectromechanical System-Based Micro Hot-Plate Devices, J. Hildenbrand, A. Greiner, and J.G. Korvink

Vibration Energy Harvesting with Piezoelectric Microelectromechanical Systems, M. Marzencki and S. Basrour

Self-Powered Wireless Sensing in Ground Transport Applications, A. Kasyap and A. Edrington
Finançat per UE